Sure here's the update: 9/1/16 update - we are in production: As a general update the barrels, flippers, capacitive PCBs, xwhatsit controller PCBs, case molds, and ribbon cables finished production and I need to get the die cast zinc cases themselves, the ultra compact cases, the key molds and keys themselves, and the inner assembly plates made.
Unfortunately the die cast zinc case molds and cases have been a bottleneck these past couple months and that continues to put us behind my original schedule. We are now looking at these leaving China in November in my estimate.
I updated the OP's with this update.
As mentioned before the two threads for the most part have different content, unless the update is extra important. By mistake I posted the GB update in the IC thread (corrected now).
The IC thread focuses on ongoing new developments of the project that have not been finalized, such as gauging interest in various configurations of the ultra compact cases and general F62/F77 keyboard questions (xwhatsit controller, powdercoating, die cast zinc molds, etc.). I am still getting feedback on colors and finish options. I am looking to expand the color offerings based on anyone's suggestions (if there's extra interest, the one-time color cost can be divided among more people).
The GB thread will continue to focus on production updates and questions related to placing and modifying orders, including order options, logistics, and customizations like the limited edition True Red case color that was recently approved for production.
