Both of those packages are going to be difficult to solder. QFN is possible but still difficult and the other is BGA so without hot air you will be SOL. I normally use my reflow oven for BGA as well because it takes the guess work out of hot air.
USB is tricky. It is differential signaling. You HAVE to match the length of the traces within spec to match trace impedence. There are very specific rules and they only get tighter with USB3.x
I suggest going something in the TQFP route. I use TI for stuff like this personally as well.
My honest suggestion is go with the high density TQFP like this
http://www.ti.com/product/tusb4041i and read some tech notes
http://www.atmel.com/images/doc7633.pdfMatch those trace lengths and lay a ground plane under the ENTIRE USB area (if you split it up or start cutting out spots for traces you risk creating capacitors on your PCB). I use a tantulum cap right at the Vusb input from the bus, but for home use this might not be necessary. Also I use correctly spec'd ferrite beads on Vusb and GND also not necessary for a home design.
That is about the best advice I can quickly give you. Have fun!
Edit: also there are limits to inrush current and stuff like that (incase you decide to go RGB crazy on your keypad hub. It would help to read the USB spec. I have done this and can attest it is a dry read. Since you only really plan on laying out a hub you could probably get away with just using google to read lots of tech notes.
-Zack-