Hello, late update due to... life happening, but excited to share these updates!
Prototypes:
2 rounds of prototypes have finished, as there is an additional cost & waste to creating a new anodization pool for prototypes with custom colours anodization chips will be used to represent the custom colours. Currently, I have decided to commit to a blue and green variant, though please do let me know your thoughts on red!
(Left: picture from production, Right: picture from me)
Prototype 1 Images Gallery Here and
Here
Prototype 2 Images Gallery Here (yet to be edited)
Visible difference from V1 and V2
Renders with all colors and metal combos here: Brass Stainless SteelSpecifications:
8 degree typing angle.
22mm front height (EKH = 24.5mm)
F13 TKL layout with ISO and tsangan support.
ESD protection through the C3 Unified Daughterboard
Centred USB-C
Adhesive Poron Gasket mount
OR
Sandwich O-Ring top mount (Subject to change to just be top mounted)
VIA compatibility
Hot-swap has now been added, standard ANSI layout.
PCB is designed by me, south-facing and will not have any RGB or LED support.
Planned Materials:
Aluminium 6063 (Top and Bottom)
Stainless Steel 303, Mirror Finish (Weight and Midsection)
Estimated Price: $500 - $600
Length: 364mm
Width: 138mm
Height (Highest Point): 40.7mm
Weight: ~2.6kg (~5.7lbs) not fully assembled
Top Bezel: 10mm
Side Bezels: 7.5mm
Bottom Bezel: 8.2mm
MOQ will range from 300-500.
An SE proto has also been made, reviewed, and I have decided against in pursuing this variant.
(Exploded SE Version shown, will not be in production)
Current Weight DesignThis is the current weight design. What the current weight design will look like and the finish will be bead blasted here.
Plate & Layouts
The current plan for plate materials will be: Brass, Aluminium, PC
Assembly midsection change (Top is previous, Bottom is new)
Sound Test: It isn't the best of sound tests, but should be the gist of what it is. I will create a new and more consistent sound test in the near future.
hereKnown Issues:This has been addressed with the manufacturer, and they'll keep a keener eye on these details. The middle section is not an easy process so there may be some inconsistencies. I will do my best to communicate to keep this to a minimum. Additionally, for every unit, it will be fairly common for each middle section to have a small bend. This bend should not impact assembly and should not require strong force to bend it into position.
Some blemishes have been noted with the sand blasted variant of the SS, it has been mentioned that this portion is a weakness of the surface treatment and will work on minimizing these issues.
Required changes:I am discussing with the carrying case manufacturer on changes as the current mould is pretty tight and an incredibly snug fit. The change should allow for easier insert and removal of the board, and the additional space for cloths if need-be.
Please comment and share! I am dedicated to make this keyboard the best it can be and would love to know your thoughts and opinions.
Collab(s):
I will be working with FJ Laboratories for the PCB production processes.
LinksAll recent updates have gone through the discord.
DiscordInstagram
Special thanks to Hadi (33c) and ai03 (atelier) discord's for making this possible.
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