geekhack
geekhack Community => Off Topic => Topic started by: tp4tissue on Thu, 10 November 2022, 10:58:27
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Tp4 uses dat mx-4 on cpu cuz it's cheep.
Liquid Metal for delid cpu die.
Gelid extreme for gpu.
Ne1 considering getting the new arctic MX-6 ? just came out. allegedly 5C better than mx-4
(https://i.imgur.com/uqAeXBu.gif)
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Thermal Grizzly Hydronaut and Kryonaut - sometimes I use Shin-Etsu (X23), MX-4, EK's TiM, Artic Silver 5, Noctua's NT-H1/H2 depending on the client's preferences or what the hardware's specs are.
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the noctua paste is regarded as one of the best thermal pastes on the market rn. i personally use a cheap high heat conductivity genesis branded one and its been doing really well in my usecase
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kyronaut works well for me in many cases. I've used carbonaut and one of them diamond graphite pads b4 to good success. The noctua h1 works good as well.
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it's all the same
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it's all the same
blasphemy !!
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Whatever is handy for the most part, differences are minimal at best in most cases.
Most thermal paste you see is a white label product.
If I'm buying I'll buy MX4, good bang for the buck.
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Just had a look in my bag, I've got lots of Thermalright Chill Factor, MX-4, Gelid GC Extreme, XSPC X2, an ancient Arctic Silver (3 I believe - all the text is worn off!), an unused tiny "Revoltec" and a nearly empty Shin-Etsu Micro, alongside some Arctic Alumina two part adhesive which appears to be solid.
What's currently on my CPU? I have no idea, it's been there for years and still seems to work OK. Being as my last CPU die cracked I'm scared of my dodgy Chinese converted one doing the same.
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Just had a look in my bag, I've got lots of Thermalright Chill Factor, MX-4, Gelid GC Extreme, XSPC X2, an ancient Arctic Silver (3 I believe - all the text is worn off!), an unused tiny "Revoltec" and a nearly empty Shin-Etsu Micro, alongside some Arctic Alumina two part adhesive which appears to be solid.
What's currently on my CPU? I have no idea, it's been there for years and still seems to work OK. Being as my last CPU die cracked I'm scared of my dodgy Chinese converted one doing the same.
LOL, Tp4 still has a tube of arctic silver 5, 20g, only used about 6g of it from idk, 10+ years ago.
Whatever is handy for the most part, differences are minimal at best in most cases.
Most thermal paste you see is a white label product.
If I'm buying I'll buy MX4, good bang for the buck.
Intel's IHS concavity is also so poorly quality controlled in uniformity that it alone can cause 5-8 C delta between chips.
AMD's IHS has been much flatter and more uniform.
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Intel's IHS concavity is also so poorly quality controlled in uniformity that it alone can cause 5-8 C delta between chips.
AMD's IHS has been much flatter and more uniform.
And dodgy Chinese people's? It was shiny like the one in this vid but mine's faster (4980HQ :thumb:)
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Intel's IHS concavity is also so poorly quality controlled in uniformity that it alone can cause 5-8 C delta between chips.
AMD's IHS has been much flatter and more uniform.
That only matters if overclocking in most cases, and if a few degrees is the difference between stable and unstable, you're not stable.
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Intel's IHS concavity is also so poorly quality controlled in uniformity that it alone can cause 5-8 C delta between chips.
AMD's IHS has been much flatter and more uniform.
That only matters if overclocking in most cases, and if a few degrees is the difference between stable and unstable, you're not stable.
mmm.. yea... but for example if you go from a Dual tower cpu cooler to Single tower, it's about 5-8C, so if you get a bad IHS, it's like wasting $30+ going to the bigger cooler.
(https://cutekawaiiresources.files.wordpress.com/2018/07/79.gif?w=560)
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for pretty much everything i use GD900 and for high power laptops i use mastergel maker, just because laptops need all the helps they can get
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g I'll buy MX4, good bang for the buck.
Intel's IHS concavity is also so poorly quality controlled in uniformity that it alone can cause 5-8 C delta between chips.
AMD's IHS has been much flatter and more uniform.
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I'm sure DerBauer would disagree on the AMD IHS (mainly on the Zen 4's). Even on the AM4 chips the IHS has been slightly convex - seen via users lapping the IHS showing it's not uniform/flat.
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I'm sure DerBauer would disagree on the AMD IHS (mainly on the Zen 4's). Even on the AM4 chips the IHS has been slightly convex - seen via users lapping the IHS showing it's not uniform/flat.
Absolute flatness isn't what I'm talking about, intel's ihs's tolerance is extremely poor, and it differs between batches/ countries of origin. To the point that it's been difficult to optimize heatsink cold plate geometry on part of the cooler manufacturers because it's not 1 size fits all.
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Then there's Intel's LGA1700 issues. Long chippy in a long package, held down only at the center so the package bows. My 12900k had half the P cores at 100C under LinX in a single pass, using a 280mm AIO with 4 pressure fans in push/pull. I put a Thermalright frame on it and some cores dropped 10c, but still have a couple that hit 100C after a few consecutive passes. Next up is a de-lid and enter the world of "what liquid metal should I use".
For paste I've been using Arctic for years, I finally used up my MX-2 and MX-3 on other projects. Currently running MX-5 and have some MX-4 left.