geekhack
geekhack Community => Off Topic => Topic started by: tp4tissue on Tue, 28 July 2015, 16:45:49
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http://www.engadget.com/2015/07/28/intel-3d-memory-1000-times-faster/
1000x faster
10x more durable
I guess we shouldn't buy any new SSDs this year, and just wait it out....
I already got too many SSDs.
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You should sell all your SSDs to spend the $1000 you are going to need to buy a 65gb version of this new memory if you really want it this year.
Buy SSDs now. Wait three years for this to be reasonably priced.
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When will we get 1000x more dense for more TB's/$?
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When will we get 1000x more dense for more TB's/$?
maybe never, because it's possible the internet will get fast enough that no one needs local storage.
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When will we get 1000x more dense for more TB's/$?
maybe never, because it's possible the internet will get fast enough that no one needs local storage.
who will be able to afford all the bandwidth though? :)) data cap woes are real.
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When will we get 1000x more dense for more TB's/$?
maybe never, because it's possible the internet will get fast enough that no one needs local storage.
who will be able to afford all the bandwidth though? :)) data cap woes are real.
Not to mention a vast majority of the USA still doesn't have true 'broadband' internet.
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Does anyone understand the difference between the Samsung 3D nand vs the Intel?
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Does anyone understand the difference between the Samsung 3D nand vs the Intel?
one is samsung... the other is intel
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Does anyone understand the difference between the Samsung 3D nand vs the Intel?
one is samsung... the other is intel
(http://www.cute-factor.com/images/smilies/onion/3c68bb64.gif)
Gah.. it's so obvious now.. How haz I not seens it befor
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I am still wondering how far off we are from light based computing and storage.
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I am still wondering how far off we are from light based computing and storage.
Well, the 3d stacked cells work exactly like how Light-based crystal storage would work, except you don't need to shine a laser through it..
basically we won't get to LIGHT, until we need HUGE amounts of storage..
You can only make these stacks so big, before latency becomes a huge problem..
So with a "light crystal", the advantage would be the possibility for a much larger block..
We'd need to get processor speeds up to that sky-net level before it'd be necessary though..
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This is going to be hybrid, will come in DDR4 compatible DIMM form factor to have one unified pool instead of dram+nand storage. This will hopefully be available for the debut of Skylake E. Coupled with the next gen HBM based nvidia gpu on pci-e 4.0... going to be killer.
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Tp keep the nerd **** out of off topic pls
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This is going to be hybrid, will come in DDR4 compatible DIMM form factor to have one unified pool instead of dram+nand storage. This will hopefully be available for the debut of Skylake E. Coupled with the next gen HBM based nvidia gpu on pci-e 4.0... going to be killer.
I'm pretty sure HBM is faster and of similar technology.
not sure why they wouldn't just put it into the next CPU
and Charge $800 for the base model
I would totally still pay $800 for the CPU with ~8-16GB of HBM
I think even $1000, is reasonable.
like, HBM is 200-1000Gigabyte/s vs ddr3, 4 which is around 50 gb/s on 4 channels tops
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When will we get 1000x more dense for more TB's/$?
maybe never, because it's possible the internet will get fast enough that no one needs local storage.
I'm actually at this point right now with my fiber optic internet.
I used to keep all my steam games on local drive but now they literally download in minutes so it doesn't matter to delete and download games but i keep wanting bigger SSD's just because lol
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When will we get 1000x more dense for more TB's/$?
maybe never, because it's possible the internet will get fast enough that no one needs local storage.
I'm actually at this point right now with my fiber optic internet.
I used to keep all my steam games on local drive but now they literally download in minutes so it doesn't matter to delete and download games but i keep wanting bigger SSD's just because lol
I am ashamed that I have 3x 1TB ssds ... seriously, they're not even half full ...
Yes, I have a computer problem
(http://www.cute-factor.com/images/smilies/onion/7f5341cc.gif)
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This is going to be hybrid, will come in DDR4 compatible DIMM form factor to have one unified pool instead of dram+nand storage. This will hopefully be available for the debut of Skylake E. Coupled with the next gen HBM based nvidia gpu on pci-e 4.0... going to be killer.
Wait, so your memory and storage will be the same thing? That's awesome.
I remember as a kid loading Doom into ramdisk. It loaded so fast. I thought SSD's were finally bringing us to that point, but it looks like this might close the gap even further.
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I wonder how they're going to cool it... maybe micro pipes with liquid? Traditional flat chips expose enough surface for traditional cooling, but a 3D chip exposes very little surface of each layer.
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I wonder how they're going to cool it... maybe micro pipes with liquid? Traditional flat chips expose enough surface for traditional cooling, but a 3D chip exposes very little surface of each layer.
They're 3D chips, but those layers are touching.. so flat cool will be fine..
ALTHOUGH..... it'd be kinda cool if they NEEED watercooling for Overclocking like back in the DDR 1 days.
hahahahahah
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I wonder how they're going to cool it... maybe micro pipes with liquid? Traditional flat chips expose enough surface for traditional cooling, but a 3D chip exposes very little surface of each layer.
They're 3D chips, but those layers are touching.. so flat cool will be fine..
ALTHOUGH..... it'd be kinda cool if they NEEED watercooling for Overclocking like back in the DDR 1 days.
hahahahahah
Silica has a VERY poor thermal transfer coefficient (thermally grown silica TC = 1.3 W/mK)... So the heat won't transfer THROUGH the layers. It's gonna need some form of heat transfer mechanism to cool the inner layers.
For comparison, aluminium has a TC of 205 W/mK, copper = 401.
Even my single layer DDR3 needs heat spreaders.
The other option is to run it really slow... but that kind of defeats the purpose of the design.
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I wonder how they're going to cool it... maybe micro pipes with liquid? Traditional flat chips expose enough surface for traditional cooling, but a 3D chip exposes very little surface of each layer.
They're 3D chips, but those layers are touching.. so flat cool will be fine..
ALTHOUGH..... it'd be kinda cool if they NEEED watercooling for Overclocking like back in the DDR 1 days.
hahahahahah
Silica has a VERY poor thermal transfer coefficient (thermally grown silica TC = 1.3 W/mK)... So the heat won't transfer THROUGH the layers. It's gonna need some form of heat transfer mechanism to cool the inner layers.
For comparison, aluminium has a TC of 205 W/mK, copper = 401.
Even my single layer DDR3 needs heat spreaders.
The other option is to run it really slow... but that kind of defeats the purpose of the design.
I'm 99% sure modern ddr3 doesn't need heatspreaders.. and that it's all fo-sho..
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I am still wondering how far off we are from light based computing and storage.
Can't be that far, intel's Light Peek tech was being worked on being internalised from my understanding (before it launched on macbooks etc)
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I am still wondering how far off we are from light based computing and storage.
Can't be that far, intel's Light Peek tech was being worked on being internalised from my understanding (before it launched on macbooks etc)
An optical data interconnect is not related to optical transistor or logic gates, so it doesn't really mean we're any closer to optical processing or storage.
And even if current DDR3 chips don't need heat spreaders they still get hot and need cooling and won't last that long if covered by thermal insulation, especially if that insulation is also producing heat (each layer will both insulate and generate heat). So, I wonder how they are cooling the layers.