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Off Topic / Re: Gaming PC Parts discussion thread.
« Last post by tp4tissue on Sun, 08 November 2026, 12:19:05 »Went in, cleaned out stock liquid metal today, replaced with 7950.
Runs gud'
You can already see the liquid metal is alloying, Hard blackish patches. Overtime, the heat conduction becomes really uneven and no-bueno.
Basically, realistically, liquid metal still has pump-out issues because the chip flexes alot under heat.
It's better than paste, but after about 1 year, 1.5 years, the conduction becomes very uneven.
Finally, Liquid metal in laptops , it's just not safe. Tp4 took it apart, and you could already see the liquid metal has run up against the foam "dam".
If you drop or shook this thing hard enough, there's more than enough liquid metal in there to short out the whole Kuhjiggr.
Peace of Mind. Just say no to Mobile Liquid Metal.
Examples below, Tp4's chip is smaller, but same issue. Look at all the black stuff. Gallium not only alloys with copper, but also nickle, even with nickle plating, it's not bulletproof.
That foam dam material is also really bad. It hardens and thins out over time due to extreme heat in laptops. So eventually, it's no longer a soft pliable material, it hardens, and becomes brittle, it's only a matter of time before it leaks.
Another scenario is, the foam melts enough to form a full air seal around the core. If you went from cold to hot air, and it's hardened+brittle, you can have A BLOW OUT, where the liquid metal Explodes outward following the hot air breaking the seal.
Runs gud'
You can already see the liquid metal is alloying, Hard blackish patches. Overtime, the heat conduction becomes really uneven and no-bueno.
Basically, realistically, liquid metal still has pump-out issues because the chip flexes alot under heat.
It's better than paste, but after about 1 year, 1.5 years, the conduction becomes very uneven.
Finally, Liquid metal in laptops , it's just not safe. Tp4 took it apart, and you could already see the liquid metal has run up against the foam "dam".
If you drop or shook this thing hard enough, there's more than enough liquid metal in there to short out the whole Kuhjiggr.
Peace of Mind. Just say no to Mobile Liquid Metal.
Examples below, Tp4's chip is smaller, but same issue. Look at all the black stuff. Gallium not only alloys with copper, but also nickle, even with nickle plating, it's not bulletproof.
That foam dam material is also really bad. It hardens and thins out over time due to extreme heat in laptops. So eventually, it's no longer a soft pliable material, it hardens, and becomes brittle, it's only a matter of time before it leaks.
Another scenario is, the foam melts enough to form a full air seal around the core. If you went from cold to hot air, and it's hardened+brittle, you can have A BLOW OUT, where the liquid metal Explodes outward following the hot air breaking the seal.
